Mechanic BGA S45-A9 Stencil Feature: Stepped groove design enables the stencil to align with the tinning position of ic rapidly. The square hole design makes it easier to take out the formed solder balls. This 3D stencil is easy to use no matter if you are a new expert. With the high success rate of planting tin, the solder balls can be formed once you are proficient. This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its use life longer.
