Sunshine SS-101A IC Glue Removing Tools Features: Elasticity is tougher, high-temperature resistance, no deformation, no sticky tin Using this tool to repair BGA chips, for example, baseband, CPU, etc. can have a multiplier effect with easy operation Using the best copper material after rolling, extruding, and drawing process Using good aluminum materials, rolling, polishing, and other processes, Breakthrough the traditional craftsmanship, the surface feels and internal hardness reach the best condition, light, and convenience. Carefully polished Pen-shaped design, breaking through the traditional polishing process. For mobile phone motherboards various small parts disassembly
