SUNSHINE SS-T12A -X3 HEATING MOULD Adopting a 185-degree layered process to remove the IP-X motherboard, is not only from our fine analysis of IP-X solder paste but depends on the special heating design and precise temperature control of SS-T12A. SS-T12A only heats the area where the IP-X board needs to be removed to prevent improper heating. Dual bayonet design, make sure the IP-X motherboard is stable on the stage. High-purity copper is used as a film to ensure uniform heat transfer and heat. T12A-X3:for x xs max motherboard layering, easy to use, stratified 185 degrees accurate rapidly separated disassembly heating station
