SUNSHINE SS-T12A ANDROID MOULD Adopting a 185-degree layered process to remove the IP-X motherboard, is not only from our fine analysis of IP-X solder paste, but depends on the special heating design and precise temperature control of SS-T12A. SS-T12A only heats the area where the IP-X board needs to be removed to prevent improper heating. Dual bayonet design, make sure the IP-X motherboard is stable on the stage. High-purity copper is used as a film to ensure uniform heat transfer and heat. T12A-Android: Android series mobile phone motherboard, CPU, hard disk chip heating and removal, need to be used with T12A
