Relife RL-402 No-clean 183°C Soldering Paste for Phones BGA Rebelling Soldering The RELIFE RL-402 Soldering Paste is a high-quality soldering paste used in electronics and electrical work, ensuring strong and reliable solder connections. Feature 1. Good adhesion. Paste delicate, particles small, only 20~38 microns. 2. Excellent wettability. After opening, the surface remains moist for 36 hours. Does not affect the welding. 3. Lead solder paste, 183 the degree of melting point, easy welding, easy molding Application Mobile phone chips repair, computer, and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 / forming fast and easy-to-weld conductive Trusted by professionals Smooth, clean finish Quick melting, no mess Ideal for BGA/SMT work Apply directly to the soldering area using a fine-tip applicator. Heat with a hot air gun or soldering iron for best results.
