Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair

Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair   RELIFE RL-404 Lead-free Solder Paste Low-Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin RELIFE RL-404 138° Soldering Paste is a specialized soldering paste with a 138° melting point, designed for efficient and reliable electronic soldering applications. Meet the maintenance needs of motherboards for Samsung, Oppo, Vivo, Redmi and Apple, etc. high-end machines A low-temperature lead-free solder paste customized for high-end motherboard repair RL-404 138 ° C low-temperature solder paste